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Supports: Jack-detection, Multi-streaming, Front Panel Jack-retasking
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Realtek® S1220A 7.1 Surround Sound High Definition Audio CODEC* Intel® 10th processors support PCIe 3.0 x16ġ x USB 3.2 Gen 2x2 port (1 x USB Type-C™)ġ x USB 3.2 Gen 1 connector (supports USB Type-C™)ġ x USB 3.2 Gen 1 header supports additional 2 USB 3.2 Gen 1 portsĢ x USB 2.0 headers support additional 4 USB 2.0 ports Intel® 11th processors support PCIe 4.0 x16 any other 3rd party SSDs installed in PCH-attached slots.
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Intel® SSDs installed in both CPU-attached and PCH-attached slots, or 2. * Raid function for PCIe mode SSD in Intel® Rapid Storage Technology is available with either 1. Only Intel® 11th Core™ processors support PCIe 4.0 x4 mode, this slot will be disabled for other CPUsġ x M.2_2 slot (Key M), type 2242/2260/2280/22110 (supports PCIe 3.0 x4 & SATA modes)ġ x M.2_3 slot (Key M), type 2242/2260/2280 (supports PCIe 3.0 x4 & SATA modes) * Graphics specifications may vary between CPU types. Requires compatible Intel® Processor w/ Integrated Graphics: * 10th Gen Intel® Core™ i9/i7 CPUs support 2933/2800/2666/2400/2133 natively, others will run at the maximum transfer rate of DDR4 2666MHz. Supports Intel® Extreme Memory Profile (XMP) Supports Intel® Turbo Boost Technology 2.0 and Intel® Turbo Boost Max Technology 3.0Ĥ x DIMM, Max. Intel® Socket 1200 for 11 th Gen Intel® Core™, 10 th Gen Intel® Core™, Pentium® Gold, and Celeron® Processors
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Visit the Manufacturer Web Page for Full Details Compatibility Pair your GUNDAM motherboard with any ASUS WiFi 6 router and experience a new level of connection. Perhaps more importantly for power users, it's optimized for more efficient operation on crowded networks. The embedded Intel® WiFi 6 module is compatible with the 802.11ax standard and pushes theoretical peak bandwidth up to an incredible 2.4 Gbps. ULTRAFAST NETWORKING FOR SMOOTHER GAMEPLAY Three M.2 slots with heatsinksĮach M.2 slot has a dedicated heatsink keep the M.2 SSDs at optimum operating temperature to ensure consistent performance and reliability. High-quality thermal pads help transfer heat from the inductor and phase array to the heatsink. The total surface area of the VRM heatsink is 1.6X that of the previous generation. The extensive surface area of the large, high-mass heatsink covers the VRM and choke to improve heat dissipation.